For recombination to happen, the presence of electron, hole and sometimes medium to support it (defects, phonons,...) is required. Sometimes the surface will be either accumulated or inverted (due to i) fixed charges in the passivation layer ii) work function difference ...), where one type of charge carriers are comparatively very large. In such cases, the probability of finding the other carrier to recombine is very low and hence, recombination is very low - called as field-effect passivation. For eg.: In case of Al2O3 on p-type crystalline silicon [cSi(p)] creates lot of holes on the cSi(p) surface (accumulation) - as it is negatively charged dielectric over cSi(p). Since there are lot of holes on the cSi(p) surface, the electrons will be very low there and hence the recombination. Suppose if the number of electrons and holes are equal, then the recombination rate will be the maximum. In addition, when the medium which assist the recombination is reduced (say surface defects are reduced), recombination reduces - called as chemical passivation. Hope it helps.