VIA GO Teardown

Written By: Artur Huhtaniemi
Published: 02/02/25
  • Comments: 0

VIA GO Teardown

Published: 02/02/25

Teardown

Introduction

Explore internals of the device: layout, components and upgradability.

GIGABYTE VIA-GO motherboard, model MZBSWOP-W1

Intel Celeron N3010 (cpuid 406C4)

LPDDR3 1.35V SODIMM

integrated eMMC (SD) Kingston M52532 1AED76C6 32Gb

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    • USB and audio ports at front and rest of I/O are at the back. power button is on top.

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    • Remove four (phillips) screws on the bottom of the device, these are located inside of rubber feet.

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    • remove screws that hold motherboard in the case.

    • LPDDR3 slot (there is no internal memory).

    • M.2 slot with Intel 3160NGW (Dual-band AC-WiFi + BT)

    • 20-pin connector for external SATA hard drive.

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    • screws to remove fan assembly

    • screws to remove heatsink

    • RTC battery

    • eMMC (SD) chip

    • power button

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    • closeup of Intel N3010 SoC and eMMC chip.

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    • component overview. also closeup of 20-pin external sata connector.

Author

Artur Huhtaniemi

Member since: 05/12/24

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